IBM, Samsung and GLOBALFOUNDRIES to showcase chip technology at March forum
IBM, Samsung and GLOBALFOUNDRIES to showcase chip technology at March forum
  • Korea IT Times (info@koreaittimes.com)
  • 승인 2012.02.13 10:56
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California, USA ― IBM, Samsung Electronics, and GLOBALFOUNDRIES are forming the world's largest chip-making consortium. This exhibition will be held at the 2012 Common Platform Technology Forum at the Santa Clara Convention Center on March 14.

The companies will address next-generation semiconductor innovations and cover critical topics such as 28-, 20- and 14-nanometer processes. This includes innovations beyond 14nm and 450mm wafer manufacturing. Technology jointly developed by the Common Platform companies’ features more than 20 additional company members—which are the majority of the world's mobile devices and consumer electronics.

Registration for the complimentary, one-day event at the Santa Clara Convention Center opens today. Please visit their website for registration information http://www.meetingconsultants.com/CommonPlatform/IBMBLAST 

“The Common Platform alliance is built upon an unmatched legacy of invention and deep commitment to research and development from IBM. The expertise of the companies is driving breakthrough technology innovations for semiconductor manufacturing. Our extensive and open ecosystem focuses on core manufacturing capabilities and gives our customers a flexible way to bring a wide range of semiconductor products to market,” said Michael Cadigan, general manager of IBM's microelectronics division.

The Common Platform Technology Forum will include keynotes from industry leaders and presentations from senior members of the Common Platform partners’ management and technical teams. The forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, packaging and design service companies.

The Common Platform 
IBM, Samsung, GLOBALFOUNDRIES and more than 20 additional companies form the Common Platform alliance which focuses on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP and design services industries. This ecosystem allows foundry customers to source their chip designs to multiple 300mm foundries with minimal design work, unprecedented flexibility and choice.



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