SEOUL, KOREA - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and SoftAtHome, a provider of home operating platforms enabling convergent services for the digital home, today announced their extended collaboration to enable operators to deliver Ultra High Definition (UHD) viewing experiences on the latest-generation set-top boxes with ST chips inside.
With UHD content increasing and being transmitted for the first time from some major international sporting events, including the Winter Olympic Games and the upcoming FIFA World Cup™, 2014 is set to be the year for 4K lift-off. The integration of ST’s Cannes Ultra/STiH312 client-box SoCs in SoftAtHome’s ScreenAtHome software platform enables the creation of cost-optimized solutions for delivering UHD content in the digital home and enriching operators’ offerings beyond traditional Pay-TV services. It will also allow Ultra High Definition content streaming over broadband and other high-speed connections.
“Our Cannes Ultra set-top box chipset aims to accelerate the adoption of UHD technologies,” said Hervé Mathieu, Box and Gateways Business Line Director, Unified Platform Division, STMicroelectronics. “SoftAtHome’s integration of our Cannes Ultra chipset extends our collaboration and provides end users with the best viewing experience and network performance.“
“4K and Ultra High Definition are taking off in 2014, especially with exciting international events such as the FIFA World Cup,” said Michel Degland, CEO of SoftAtHome. “With ST’s latest products, we can now enable our operator customers to benefit from an HEVC for HD eligibility extension and unleash powerful UHD services for a truly immersive user experience and optimum performance. It gives our Software platform a competitive edge to complement our award-winning functionality and integration capability.”
ST and SoftAtHome will demonstrate cost-optimized solutions for delivering UHD content in the digital home at TV Connect 2014, March 18-20, London.
