LOS ALTOS, Calif., Aug. 10, 2017 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (NASDAQ:DSPG), a leading global provider of wireless chipset solutions for converged communications, and LISNR®, a leading global provider of data-over-audio technology, announced today the Audio-D, a solution that supports data-over-audio communication for any device with a speaker or microphone. This solution, based on DSP Group’s DBMD4 Voice SoC and LISNR® technology, overcomes device-to-device hardware restraints regarding RF protocols. This enables always-on communication and high level of interoperability while consuming low power.
Over the past 20 years, the connected industry has made significant advancements in connecting devices from afar. In that same time it’s become increasingly difficult to facilitate an initial or always-on connection to devices in close proximity, due to hardware and RF limitations. Short-range wireless device detection and data transmission across all connected devices can be quite difficult utilizing the current methods or protocols.
The cooperation of DSP Group® and LISNR® solves these hurdles and creates the ultimate solution enabling any device manufacturer to leverage audio as a means to transmit data across devices. The solution utilizes DSP Group’s DBMD4 - an innovative, cost-effective, small form-factor voice processor. This enables voice processing in IoT devices while maintaining extremely low power consumption. LISNR® technology serves as an audio data transfer software to combat connectivity issues, efficiently identifying a device in close proximity to another device then initiating any secondary action. The secondary action could be connectivity, authentication for access, payment, ID, pairing, syncing, or data transmission such as mesh networking across all devices.
The Audio-D also offers consumers a boon in interoperability allowing advantages in cross-device flexibility. Devices becoming available with a microphone, speaker, and Audio-D will be able to detect and directly communicate with sound to any other device in the vicinity, regardless of manufacturer. This solution spans the connected device world with specific demand from auto, consumer electronics, hospitality, smart cities, healthcare, etc.
LISNR’s proprietary, near-ultrasonic protocol sends data over audio across bandwidths (12khz - 19khz) that are audible or inaudible, depending on use case and distribution method, to ensure optimal performance. Additional performance enhancements include Smart Tone™ types (ID, Text, Data), that optimize characteristics of data type for the actual use case.
“We have spent five years streamlining the ability to connect devices via sound, and this partnership is a validation of our technology and its capability. It’s the ultimate end-consumer benefit grounded in a partnership that’s rooted in seamless connectivity,” says Eric Allen, LISNR® President. “DSP Group’s DBMD4 is the ideal enabler of this solution offering low power consumption and excellent performance.”
“Advanced, ultra-low power data transmission technology using audio is a natural step in extending our wireless solutions across all devices,” says Yosi Brosh, CVP SEA Sales and Marketing with DSP Group. “We’re excited to work with LISNR on a groundbreaking solution for data-over-audio technology.”
LISNR® is the new standard for device connectivity using sound as the leading global provider of data-over-audio technology. LISNR®’s proprietary data-over-audio protocol is being used across the connected world to power over 30 million devices and counting. Founded in 2012, LISNR®’s near-ultrasonic protocol sends data over audio — enabling proximity engagement, seamless and secure methods of authentication, and device to device data transmission for automation and connectivity. For more information, visit http://www.lisnr.com.
About DSP Group®
DSP Group®, Inc. (NASDAQ:DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com.
CONTACT: DSP Group Contact Tali Chen CVP, Corporate Development & Chief Evangelist +1 (408) 240-6826 email@example.com