In-Mold Electronics 2019-2029: Technology, Market Forecasts, Players
In-Mold Electronics 2019-2029: Technology, Market Forecasts, Players
  • by Dr Khasha Ghaffarzadeh and Dr Richard Collins
  • 승인 2019.11.09 03:55
  • 댓글 0
이 기사를 공유합니다

Example of electronics on a thermoformed substrate by Fraunhofer IVV at K Show 2019. This work in 3D electronics was done with multiple notable partners including Fujikura Kasei and Heraeus. (Photo: IDTechEx)
Example of electronics on a thermoformed substrate by Fraunhofer IVV at K Show 2019. This work in 3D electronics was done with multiple notable partners including Fujikura Kasei and Heraeus.
(Photo: IDTechEx)

 

In-mold electronics (IME) is a process of integrating printed decorations and electronic circuitry with thermoforming and molding. The results are 3D-shaped objects with embedded circuits of differing degrees of complexity. This is part of the global emerging trend to 3D structural electronics and the progression away from the rudimentary solution of components encased in a box.
 
The capacity to print electronic circuitry on a 2D substrate prior to converting this into a functional 3D part has many manufacturing and material challenges. This report covers the commercial and emerging solutions from the key players as this technology progresses from R&D to gaining high-volume end-user success.
 
IDTechEx has a long legacy in the field of printed electronics and has been analyzing the forefront of this field. The information for this new report is obtained through an extensive interview-based technical primary research.
 
The advantages of IME are numerous and include lightweight, space-saving, robustness, accelerated time-to-market, and high throughput capabilities. However, the technology does not come without its drawbacks in shape limitations, yield, software immaturity, environmental stability, and post-processing. These merits and hurdles are detailed within the report with upcoming solutions in the material-space for the functional inks, substrates, and adhesives facilitating this.
 
The prototypes have been diverse, ranging from simple devices for wearable technology, automotive light heating, antennas, and white goods touchpads to more complex sensors, actuators, and displays.
 
The commercial uptake of IME has a complex history with Ford embracing this technology for an automotive interior device, but the product had to be recalled. Despite this setback, the market is on the cusp of large adoption. Very large addressable markets are at different stages of adopting this technology with automotive interiors and touchpads for white goods providing the most significant volumes. IDTechEx forecasts the market for IME devices to exceed $1.11bn by 2029.
 
IME is not the only technological solution to 3D electronics. Aerosol jet printing, Mold Interconnected Devices (including laser direct structuring, two-shot molding, and film inserting), and 3D printing electronics are all rapidly emerging and gaining traction. This report benchmarks these technologies and looks at some key players and the latest advancements.
 


댓글삭제
삭제한 댓글은 다시 복구할 수 없습니다.
그래도 삭제하시겠습니까?
댓글 0
댓글쓰기
계정을 선택하시면 로그인·계정인증을 통해
댓글을 남기실 수 있습니다.

  • Korea IT Times: Copyright(C) 2004, Korea IT Times. .Allrights reserved.
  • #1206, 36-4 Yeouido-dong, Yeongdeungpo-gu, Seoul, Korea(Postal Code 07331)
  • 서울특별시 영등포구 여의도동 36-4 (국제금융로8길 34) / 오륜빌딩 1206호
  • * Mobile News: m.koreaittimes.com
  • * Internet news: www.koreaittimes.com
  • * Editorial Div. 02-578-0434 / 010-2442-9446 * PR Global/AD: 82-2-578-0678.
  • * IT Times Canada: Willow St. Vancouver BC
  • 070-7008-0005
  • * Email: info@koreaittimes.com
ND소프트