Picochip was in Seoul today to unveil the first in its next generation of picoXcellTM femtocell systems-on-chip (SoCs), the PC3008. The new device is optimized for high-volume cost-sensitive consumer applications. OEMs and ODMs can use it to build basestations in ultra-small form factors; for example a USB stick.
The availability of ultra-small femtocells will allow operators to easily add HSPA+ home-basestation capabilities to appliances such as residential gateways, cable modems and set-top boxes. The PC3008 features a high level of integration that will reduce the total component cost of a 3G femtocell to significantly less than $50.
The PC3008 is the first in the PC30xx family of devices. It supports eight simultaneous users with 3GPP Release 7 HSPA+ (21Mbps downlink, 5Mbps uplink) specifications. This third generation device follows on from Picochip's PC202, which defined the femtocell market in 2006, and the industry-standard PC3xx series. In common with these two previous generations, the PC3008 uses Picochip's field-proven robust baseband (PHY), already deployed in more than a million basestations worldwide.
"The rise of the femtocell is causing a fundamental rethink in the way we build, run and use mobile networks," commented Picochip Director of Corporate Marketing Andy Gothard. "Picochip's technology is in the vast majority of femtocells deployed today, driving and enabling that change. With the PC3008 and the forthcoming devices we are extending our leadership: As well as an industry-leading silicon design, we have invested heavily in system test to guarantee the most robust PHY available and the most complete reference design."
The new SoC is manufactured using 40nm process technology and features a fast (950MHz) ARM11 processor with TrustZone®. It integrates the key components of a 3G femtocell into an aQFN package just 12mm (0.5inch) square, enabling OEMs to produce smaller and more cost-effective femtocells. On-chip features include enhanced security functions and increased integration. This reduces external component count and hence bill-of-materials (BoM). The device also includes optimized support for next generation low-cost and low-power femtocell radios.
"In 2010 we saw 17 operators offer femtocells commercially, with over 1 million units shipped: that is expected to accelerate swiftly going forward in 2011," said Aditya Kaul, Practice Director, Mobile Networks at ABI Research. "Residential femtocells form the largest segment of deployments so far and is expected to remain the dominant market going forward. With smaller form factors and reducing costs, the integration of femtocells with home gateways becomes much more likely. Although we have seen increasing competition in the femtocell silicon market, Picochip remains in a strong position for the UMTS/HSPA femtocell segment. The new USB form factor is proof that they continue to innovate, push the boundaries and drive carriers to adopt femtocells much more aggressively going forward."
According to ABI's most recent report, 1.3M femtocells were shipped in 2010. This number is predicted to rise to 70.2 million in 2015, a 154% CAGR.
Picochip offers the widest portfolio of small cell technologies, ranging from low-cost residential access points to large-scale 64-user systems for enterprise and public access. Key products in the range include:
- The PC302, the industry standard for cost-sensitive residential systems (3GPP Home NodeB), the same application as the PC3008
- The more powerful PC323 supports 24 users and integrates advanced technology including receive diversity and MIMO. It is being used in enterprise femtocell systems being deployed by carriers this year.
- The PC333 is the highest-specification femtocell chip on the market, enabling basestations with up to 64 users and meeting the 3GPP Local Area Basestation standard (LABS).
As well as the SoCs themselves, Picochip offers a range of complete reference designs. These include hardware platforms, radio designs, manufacturing support and complete protocol stack software.
The PC3008 will be shipping in volume by end of the year. Other devices in the PC3xxx family will be announced later this year.
