PiBond, a company development and production of advanced liquid spin-on materials, has supplied materials to this ever-growing segment of integrated circuit sensors for a decade.
Now, the semiconductor material specialist and siloxanes pioneer adds more novel optical dielectrics to its extensive siloxane IP portfolio. PiBond’s new and existing materials reach new boundaries in optical properties, particularly the index of refraction. A recently awarded patent describes materials enabling significant increase and control of key optical constants: the refractive index and extinction coefficient, optical transmission – while still retaining excellent dielectric performance and solid environmental robustness. These are properties are essential for device and process design factors fabless designers, IMD and OEM brand owners in semiconductor optoelectronics industry.
PiBond’s molecularly designed organo-silane and siloxane polymers have found many commercial uses in advanced semiconductor devices such as smartphone imaging sensors, quantum dot displays as well in the most advanced lithography processes. PiBond doesn’t only design and develop ultra-novel materials for the semiconductor world, but also has state-of-the-art capabilities to manufacture the same. It’s factory in Espoo, Finland yields specialty siloxane and metal oxide polymers with one of the highest purities in the industry. The patent has been issued by the US Patent and Trademark Office with the number US 9,190,616.
"We are excited about the latest addition to our optical dielectric IP portfolio. Our invention sets a new record for high refractive index optical dielectrics at 1.70. This is ground breaking as we have done this without the addition of index boosting nanoparticles. We are confident that the users will receive a positive response from clients, in particular as the material behaves much in the same way as the high RI siloxanes that we have been supplying the industry for a decade," said Jonathan Glen, Chairman of PiBond. "As the industry demands new materials to meet the needs of EUV lithography, 3D memory, power ICs, image sensors, TSV and MEMS applications, PiBond is well placed to be a driving force in this transition."
