Doosan to introduce next-generation components for 5G communication at KPCA show 2022
Doosan to introduce next-generation components for 5G communication at KPCA show 2022
  • Lee Jun-sung
  • 승인 2022.09.20 13:32
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Doosan booth at KPCA show 2022 / Courtesy of Doosan

Doosan announced today that it will participate in the "KPCA show 2022" held at Songdo Convensia in Incheon from September 21-23 and introduce various copper clad laminates (CCL) and newly developed next-generation parts that can be used for 5G communication and semiconductors.

The KPCA Show is Korea's only and largest PCB and semiconductor packaging-related exhibition hosted by the Korea PCB & Semiconductor Packaging Industry Association. About 120 companies, including Doosan, Samsung Electro-Mechanics, LG Innotek, and Mitsubishi Electric, will participate this year.

Doosan will introduce various types of CCLs, including 5G antenna modules and MEMS oscillators, at this exhibition.

The 5G antenna module is a key component of a 5G wireless repeater to which Beamforming antenna technology is applied. This is an integrated solution module equipped with functions such as signal transmission/reception and frequency conversion.

By using beamforming antenna technology, communication quality can be dramatically improved by minimizing signal interference between users and transmitting 5G signals in a desired direction.

Currently, it can respond to the 28GHz frequency band of all mobile carriers in South Korea, and 26GHz and 39GHz antenna modules are also being developed to enter and expand overseas markets such as China, Europe, and the United States.

Oscillator is a key component that generates internal signal frequencies of electronic devices and communication systems.

Doosan's MEMS Oscillator is a product that applies the microfabrication technology of the semiconductor manufacturing process. It transmits two frequencies simultaneously from one device and has high durability against external shocks or electromagnetic waves.

It is also suitable for wearables and mobile devices because of its low power consumption and good space efficiency through miniaturization.

In addition, Doosan plans to introduce various devices such as CCLs for packages that electrically connect semiconductor chips and mainboards and protect semiconductors.


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