KCC's Eco-Friendly Heat Dissipating Powder Coating: Enhancing Durability and Extending Device Lifespan
KCC's Eco-Friendly Heat Dissipating Powder Coating: Enhancing Durability and Extending Device Lifespan
  • Lee Jun-sung
  • 승인 2023.07.24 11:41
  • 댓글 0
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KCC announced on July 24 that it has developed and completed a patent application for a heat dissipating powder coating that can extend the life of equipment by suppressing the internal temperature rise of electronic devices. / Courtesy of KCC

KCC Corporation (KCC) announced on July 24 that it has developed and completed a patent application for a heat dissipating powder coating that can extend the life of equipment by suppressing the internal temperature rise of electronic devices.

The new heat dissipation powder coating efficiently disperses heat inside electrical and electronic products and releases it to the outside, preventing devices from heating up and causing malfunctions and shortening their lifespan. 

The heat dissipation powder coating is applied to the casing of devices that generate heat, and the materials with excellent thermal conductivity contained in the heat dissipation powder coating are designed to transfer the internal thermal energy and effectively dissipate it to the outside.

In addition, it is a product with excellent durability and corrosion resistance that is resistant to external impacts and damage. Unlike ordinary paints, it does not use volatile solvents, so it is safe because there is no risk of fire, and it is eco-friendly because it does not pollute the air or water quality.

Since it is a powdered coating, it is easy to store and transport, and it also has economic advantages because it produces little waste. 

The heat dissipating powder coatings developed by KCC can be applied to various fields such as home appliances, laptops, smartphones, LED lighting devices, electric vehicle chargers, batteries, and energy storage systems (ESS), which are commonly found in everyday life, and are expected to expand the market across industries. 

In particular, in recent years, due to the lightweight, miniaturization, high capacity, and high power of electromobility and advanced electrical and electronic devices, including electric and hydrogen vehicles, the chips used in electronic circuits are becoming highly integrated, which leads to a rapid increase in power consumption.

As the use of devices is often limited due to technical limitations in dissipating the heat generated at this time, heat dissipation technology applied to this product is becoming a key area for future advanced technology development.
 


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