- The technology is a breakthrough semiconductor chiplet packaging technology that can save 95% power compared to existing Japanese technology.
In a significant breakthrough, domestic researchers at the Electronics and Telecommunications Research Institute (ETRI) have achieved a monumental milestone in the semiconductor industry. ETRI has successfully developed a revolutionary 95% power-saving semiconductor packaging technology, marking the first time such an advancement has been accomplished.
This cutting-edge technology utilizes a new film material called non-conductive film (NCF), developed by ETRI through its own nanomaterial technology. The semiconductor chiplet packaging process, which previously required a complex nine-step procedure, has now been streamlined to just three simple steps.
The key to this breakthrough lies in the core new material, a polymer film made of epoxy-based substances and a reducing agent, with a thickness ranging from 10 to 20 micrometers. The material exhibits remarkable properties required for post-processing (packaging) of semiconductors and acts as a superior bonding material, thanks to its unique characteristics.
By employing a one-second cotton laser, researchers can complete the bonding process, eliminating the need for multiple steps such as cleaning, drying, coating, and curing, which were common in the previous packaging processes. This new approach not only drastically reduces the power consumption but also eliminates the generation of harmful substances during the process.
Moreover, the advanced semiconductor chiplet packaging technology developed by ETRI enables a high-precision process that can be applied to various chiplet packages. Remarkably, this precision can be achieved at room temperature, setting it apart from traditional methods that required heating to 100℃, resulting in higher power consumption, increased errors, and reduced reliability due to thermal expansion.
ETRI's new technology has already garnered significant attention from major players in the semiconductor industry, including global foundry companies and a U.S. micro LED startup. With evaluations currently underway, it is expected to be commercialized within the next three years, promising a low-power and environmentally friendly solution for semiconductor display companies.
The potential of this groundbreaking technology extends beyond its current applications. It is foreseen as a core material technology for manufacturing AI semiconductors with high-performance demands, such as those required for autonomous driving and data centers.
ETRI's achievement reflects the nation's commitment to self-reliance in semiconductor materials and technology. In the past, the industry heavily relied on Japanese materials and equipment technology. However, ETRI's breakthrough not only addresses market demands but also empowers the country to take significant strides toward sustainability and eco-friendliness.
As ETRI's groundbreaking semiconductor packaging technology gains recognition and validation at major industry conferences, the market for chiplet packaging is projected to reach an impressive $23.9 billion by 2027.
With strong support from the Ministry of Science and ICT's Leading Materials Innovation Project, ETRI's success is a testament to the power of collaboration between key research institutions, including KIST and the Korea Advanced Institute of Manufacturing Technology.
ETRI's dedication to innovation is evident in their continued efforts, as they have previously developed the SITRAB new material technology, the world's first LED transfer and bonding process combined into one. Active technology transfer negotiations with related companies showcase the industry's eagerness to adopt their game-changing solutions.
ETRI's groundbreaking semiconductor packaging technology has opened up new horizons for the industry, enabling sustainable, energy-efficient AI semiconductors that will drive technological progress and inspire the semiconductor powerhouse to scale even greater heights.
