Demand for advanced automotive semiconductors is rising due to the growth of electric vehicle technologies.
A team from Korea has created a machine that uses laser and waterjet technology to process crucial parts of these semiconductors.
Led by researcher Sanghoon Ahn at the Korea Institute of Machinery and Materials (KIMM), the team developed a laser-waterjet machine that can process tough materials effectively. These semiconductors are vital for controlling electronic equipment and engines in vehicles. Electric and self-driving cars need more of these semiconductors than traditional vehicles.
The new machine makes it easier to cut a material called silicon carbide (SiC), which is important for automotive semiconductors. Previously, SiC processing relied on imported machines because the material is hard to work with. This new machine, however, can handle SiC efficiently.
The team also accomplished a couple of significant achievements. They created a 200W green nanosecond laser, which was previously only available through imports. They improved the laser's focusing ability, making it nine times more accurate than before.
The machine's design allows for a smooth flow of water, and the laser is directed through this flow, creating a precise cutting process. This works at various points along the water stream.
Typical laser machines process quickly but lack precision, while ultrafast lasers are precise but slower. This new laser-waterjet machine combines speed and precision, making it efficient.
Furthermore, the machine keeps the work area clean by collecting fine dust and smoke produced during processing. Importantly, it's also more affordable, costing 20% less than imported machines.
Principal Researcher SanghoonAhn of KIMM was quoted as saying, “We are very pleased to be helping to strengthen the technological competitiveness of Korea’s future semiconductor equipment industry by developing the laser waterjet machine for the first time in the country. Through the latest development, we will help to reinforce the competitiveness of the semiconductor industry and will also support Korean corporations’ efforts to expand their market share.”
Meanwhile, this research study was implemented with the support of the Ministry of Trade, Industry and Energy’s project regarding “Development of laser hybrid machine for machining of difficult to cut materials.”
