Menta, an innovative deep-tech company specializing in semiconductor design, announces its participation in the Chiplet Summit where it will unveil MOSAICS-LP - a revolutionary scalable chipset platform designed for heterogeneous chip design. This innovative platform uses a universal chassis and a curated catalog of third-party chiplets. Supported by the French government and CEA-List, a research center for intelligent digital systems, MOSAICS-LP represents a significant leap forward in semiconductor technology.
The Chiplet Summit, now in its second year, serves as a key convergence point for chip designers and industry players. It serves as a valuable forum for gaining insights into optimizing chiplet performance across key metrics such as speed, scalability, power efficiency and flexibility. In addition to fostering networking opportunities, the Summit facilitates expert interaction and exposes attendees to a wide range of products and services to ensure they remain at the forefront of chiplet technology advancements.
Menta, recognized as a pioneer in programmable logic solutions, will be showcasing MOSAICS-LP alongside its esteemed partner, CEA-List, at their joint booth.
In the current landscape of semiconductor manufacturing, traditional monolithic solutions present challenges in terms of power consumption, scalability and cost. MOSAICS-LP is emerging as a solution to these issues, especially amidst the escalating demands of production. Targeting the edge computing market, including artificial intelligence, IoT, robotics, automotive, and 5G/6G markets, MOSAICS-LP offers competitive, scalable, high-performance, and energy-efficient solutions.
Vincent Markus, CEO of Menta, said, "At the forefront of innovation, Menta, in collaboration with our strategic research partner CEA-List, takes part in the Second Annual Chiplet Summit - a must-attend event for chip designers and market players in the United States. MOSAICS-LP is redefining semiconductor solutions by addressing the power and cost challenges inherent in traditional monolithic approaches. Our breakthrough platform, focused on edge computing and embedded AI, features a unique architecture with a universal package and chiplets. Its key benefits include scalability, energy efficiency, reduced development costs and risk mitigation through pre-tested components, positioning MOSAICS-LP as an innovative solution for the evolving semiconductor landscape.
