New FormFactor Probing System Dramatically Improves Throughput and Productivity
New FormFactor Probing System Dramatically Improves Throughput and Productivity
  • Kim Min-jee Reporter
  • 승인 2018.03.08 13:11
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LIVERMORE, Calif., March 07, 2018 (GLOBE NEWSWIRE) -- FormFactor, Inc. (NASDAQ:FORM), an industry-leading electrical test and measurement supplier to the semiconductor industry, today introduced the SUMMIT200, a next-generation 200 mm probing system. The new system targets today’s needs of R&D, niche production and high-volume engineering labs for faster time to accurate data with a range of new features to improve throughput and productivity.

The SUMMIT200 is the latest addition to FormFactor’s Summit™ family of on-wafer test and characterization products, the industry’s benchmark probe systems for more than a decade. Available in semi-automatic and fully-automatic configurations, the new SUMMIT200 features automatic wafer loading and unattended thermal testing from -65° to +300°C to virtually eliminate tool idle time, as well as the need for operator setup at each different test temperature. This combination of advanced features enables up to 5X faster time to data, helping engineers to realize faster characterization and shorten time to market.

The new system includes FormFactor’s unique Contact Intelligence™ technology, bringing together FormFactor’s superior hardware design and software algorithms to ensure precise device contact and stability in an autonomous measurement system. A next-generation MicroChamber® also contributes to “drift free” probe contact, easier setup and wafer safety.

“Semiconductor and optoelectronics manufacturers today need faster measurements and increased data volumes to ensure they meet accelerating product development timelines,” said Mike Slessor, President and CEO, FormFactor, Inc. “The automation capabilities built-in to our new SUMMIT200 help our customers gather large volumes of accurate data faster. With constant pressure to reduce the cost of test and speed time to results, these capabilities provide real savings in both time and development costs.”

  1. new system will be demonstrated at booth #N4-4617 at SEMICON China, March 14-16, 2018 at the Shanghai New International Expo Center.

About FormFactor
FormFactor, Inc. (NASDAQ:FORM), is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The Company serves customers through its network of facilities in Asia, Europe, and North America. For more information, visit the Company’s website at www.formfactor.com.

The FormFactor logo, Contact Intelligence and MicroChamber® are trademarks of FormFactor, Inc.

Trade Contact
David Viera
Corporate Communications
(925) 290-4182
david.viera@formfactor.com

Investor Contact
Stan Finkelstein
Investor Relations
(925) 290-4321
ir@formfactor.com


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