SK Hynix announced on April 23 that it will fully open the era of 3D NAND by releasing 36-tier 3D NAND within the third quarter of this year and a 48-tier product by the year’s end.
In a conference call held on the same day after releasing its first-quarter financial results, SK Hynix president Kim Jun-ho revealed that the company has completed the 24-tier development at the end of last year and opened the potential for application into 3D.
Kim stressed that SK Hynix will launch the mass-production of 36-tier products in the third quarter of this year. He also noted that this (36 tier) is a multi-level cell (MLC) which will be mass-produced through computing platforms.
SK Hynix’s new plant (M14) which is now under construction in Icheon in Gyeonggi Province will be furnished with equipment from the second quarter.
SK Hynix expects the operation of M14 to contribute to increasing its DRAM wafer output by up to 15,000 sheets, starting from the fourth quarter of this year.
